Effect of temperature and film thickness on resistivity of CoWP

J. Gambino; F. Chen; S. Mongeon; D. Meatyard; E. Adams; P. DeHaven; C. Cabral Jr; I. Ivanov

doi:https://doi.org/10.7567/SSDM.2007.C-8-3

2007 International Conference on Solid State Devices and Materials

2007年9月18日〜 2007年9月21日
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[C-8-3] Effect of temperature and film thickness on resistivity of CoWP

J. Gambino、F. Chen、S. Mongeon、D. Meatyard、E. Adams、P. DeHaven、C. Cabral Jr、I. Ivanov (1.IBM Microelectronics、2.IBM Thomas J. Watson Research Center、3.Blue29 LLC)

https://doi.org/10.7567/SSDM.2007.C-8-3

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