3D Stacked Nanowires CMOS Integration with a Damascene Finfet Process

T. Ernst; C. Dupre; E. Dornel; J.C. Barbe; S. Becu; C. Vizioz; V. Delaye; F. Andrieu; J-M. Hartmann; S. Barnola; T. Poiroux; O. Faynot; G. Ghibaudo; S. Deleonibus

doi:https://doi.org/10.7567/SSDM.2007.I-1-1

2007 International Conference on Solid State Devices and Materials

Sep 18, 2007 - Sep 21, 2007
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[I-1-1] 3D Stacked Nanowires CMOS Integration with a Damascene Finfet Process

T. Ernst, C. Dupre, E. Dornel, J.C. Barbe, S. Becu, C. Vizioz, V. Delaye, F. Andrieu, J-M. Hartmann, S. Barnola, T. Poiroux, O. Faynot, G. Ghibaudo, S. Deleonibus (1.CEA-LETI, 2.IMEP, INPG-MINATEC)

https://doi.org/10.7567/SSDM.2007.I-1-1

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