[P-2-11] Non-destructive extraction of width bias variations for deep sub-micron interconnect lines
Mao-Chyuan Tang, Meng-Feng Wang, Tim Cheng, David Chen, C S Yeh, S C Chien
(1.Central R & D Division, United Microelectronics Corp.)
https://doi.org/10.7567/SSDM.2007.P-2-11
