[P-2-11] Non-destructive extraction of width bias variations for deep sub-micron interconnect lines
Mao-Chyuan Tang、Meng-Feng Wang、Tim Cheng、David Chen、C S Yeh、S C Chien
(1.Central R & D Division, United Microelectronics Corp.)
https://doi.org/10.7567/SSDM.2007.P-2-11
