[P-2-14] Void Free Room Temperature Silicon Direct Bonding by Sequential Plasma Activated Process

Chenxi Wang, Eiji Higurashi, Tadatomo Suga (1.Department of Precision Engineering, School of Engineering, The University of Tokyo, 2.Research Center for Advanced Science and Technology, The University of Tokyo)

https://doi.org/10.7567/SSDM.2007.P-2-14