[P-5-2] Tungsten Through-Si Via (TSV) Technology for Three-Dimensional LSIs

Hirokazu Kikuchi, Yusuke Yamada, Atif Mossad Ali, Jun Liang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (1.Dept. of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 2.Department of Physics, Faculty of Science, Assiut University)

https://doi.org/10.7567/SSDM.2007.P-5-2