[P-5-2] Tungsten Through-Si Via (TSV) Technology for Three-Dimensional LSIs

Hirokazu Kikuchi、Yusuke Yamada、Atif Mossad Ali、Jun Liang、Takafumi Fukushima、Tetsu Tanaka、Mitsumasa Koyanagi (1.Dept. of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University、2.Department of Physics, Faculty of Science, Assiut University)

https://doi.org/10.7567/SSDM.2007.P-5-2