[P-9-14] Current and Speed Enhancements at 90nm Node through Package Strain

Wen-Shiang Liao, Sheng-Yi Huang, Tommy Shih, Chee Wee Liu (1.United Microelectronic Corporation (UMC), 2.National Taiwan University, Graduate Institute of Electronics Engineering)

https://doi.org/10.7567/SSDM.2007.P-9-14