Current and Speed Enhancements at 90nm Node through Package Strain

Wen-Shiang Liao; Sheng-Yi Huang; Tommy Shih; Chee Wee Liu

doi:https://doi.org/10.7567/SSDM.2007.P-9-14

2007 International Conference on Solid State Devices and Materials

2007年9月18日〜 2007年9月21日
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[P-9-14] Current and Speed Enhancements at 90nm Node through Package Strain

Wen-Shiang Liao、Sheng-Yi Huang、Tommy Shih、Chee Wee Liu (1.United Microelectronic Corporation (UMC)、2.National Taiwan University, Graduate Institute of Electronics Engineering)

https://doi.org/10.7567/SSDM.2007.P-9-14

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