Accurate Channel Thermal Noise Modeling in BSIM4

J. Jeon; J. Lee; C. H. Park; J. S. Yoon; H. Lee; H. Oh; B. G. Park; H. Shin

doi:https://doi.org/10.7567/SSDM.2008.B-10-3

2008 International Conference on Solid State Devices and Materials

Sep 23, 2008 - Sep 26, 2008
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[B-10-3] Accurate Channel Thermal Noise Modeling in BSIM4

J. Jeon¹, J. Lee¹, C. H. Park², J. S. Yoon³, H. Lee³, H. Oh³, B. G. Park¹, H. Shin¹ (1.Seoul National Univ., 2.Kwangwoon Univ., 3.Samsung Electronics Co., Ltd., Korea)

https://doi.org/10.7567/SSDM.2008.B-10-3

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