[C-10-1] Galvanic Corrosion Control during Cu Chemical Mechanical Polishing of Cu Interconnects that Contain Ruthenium Barrier Metal Film

K. Maruyama¹, M. Shiohara¹, K. Yamada¹, S. Kondo¹, S. Saito¹ (1.Selete, Japan)

https://doi.org/10.7567/SSDM.2008.C-10-1