[C-10-1] Galvanic Corrosion Control during Cu Chemical Mechanical Polishing of Cu Interconnects that Contain Ruthenium Barrier Metal Film

K. Maruyama¹、M. Shiohara¹、K. Yamada¹、S. Kondo¹、S. Saito¹ (1.Selete, Japan)

https://doi.org/10.7567/SSDM.2008.C-10-1