[C-10-1] Galvanic Corrosion Control during Cu Chemical Mechanical Polishing of Cu Interconnects that Contain Ruthenium Barrier Metal Film
K. Maruyama1, M. Shiohara1, K. Yamada1, S. Kondo1, S. Saito1
(1.Selete, Japan)
https://doi.org/10.7567/SSDM.2008.C-10-1