[C-2-5] Controlling Cu Corrosion in Single Wafer Cleaning Process

M. Imai¹, Y. Yamashita², T. Futatsuki², M. Shiohara¹, S. Kondo¹, S. Saito¹ (1.Selete, 2.Organo Corp., Japan)

https://doi.org/10.7567/SSDM.2008.C-2-5