[C-2-5] Controlling Cu Corrosion in Single Wafer Cleaning Process

M. Imai¹、Y. Yamashita²、T. Futatsuki²、M. Shiohara¹、S. Kondo¹、S. Saito¹ (1.Selete、2.Organo Corp., Japan)

https://doi.org/10.7567/SSDM.2008.C-2-5