[C-5-2] Low-k Film Damage-Resistant CO Chemistry-based Ash Process for Low-k/Cu Interconnection in Flash Memory Devices

J. Lee¹, W. Park¹, D. H. Kim¹, K. Shin¹, J. Choi¹, I. Chung² (1.Samsung Electronics Co., Ltd., 2.Univ. of Sungkyunkwan, Korea)

https://doi.org/10.7567/SSDM.2008.C-5-2