Development of Multi-Scale Electromigration Simulator using Ultra Accelerated Quantum Chemical Molecular Dynamics and a Kinetic Monte Carlo Method and its Application to Cu Interconnect

H. Tsuboi; A. Chutia; C. Lv; Z. Zhu; R. Miura; A. Suzuki; R. Sahnoun; M. Koyama; N. Hatakeyama; A. Endou; H. Takaba; C. A. Del Carpio; R. C. Deka; M. Kubo; A. Miyamoto

doi:https://doi.org/10.7567/SSDM.2008.C-8-3

[C-8-3] Development of Multi-Scale Electromigration Simulator using Ultra Accelerated Quantum Chemical Molecular Dynamics and a Kinetic Monte Carlo Method and its Application to Cu Interconnect

H. Tsuboi¹, A. Chutia¹, C. Lv¹, Z. Zhu¹, R. Miura¹, A. Suzuki¹, R. Sahnoun¹, M. Koyama¹, N. Hatakeyama¹, A. Endou¹, H. Takaba¹, C. A. Del Carpio¹, R. C. Deka², M. Kubo¹, A. Miyamoto¹ (1.Tohoku Univ., Japan, 2.Tezpur Univ., India)

https://doi.org/10.7567/SSDM.2008.C-8-3

2008 International Conference on Solid State Devices and Materials

[C-8-3] Development of Multi-Scale Electromigration Simulator using Ultra Accelerated Quantum Chemical Molecular Dynamics and a Kinetic Monte Carlo Method and its Application to Cu Interconnect