Misalignment Tolerance in Inductive-Coupling Inter-Chip Link for 3D System Integration

2008 International Conference on Solid State Devices and Materials

Sep 23, 2008 - Sep 26, 2008
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

K. Niitsu¹, Y. Kohama¹, Y. Sugimori¹, K. Osada², N. Irie², H. Ishikuro¹, T. Kuroda¹ (1.Keio Univ., 2.Hitachi, Ltd., Japan)