[D-2-4] Misalignment Tolerance in Inductive-Coupling Inter-Chip Link for 3D System Integration

K. Niitsu¹、Y. Kohama¹、Y. Sugimori¹、K. Osada²、N. Irie²、H. Ishikuro¹、T. Kuroda¹ (1.Keio Univ.、2.Hitachi, Ltd., Japan)

https://doi.org/10.7567/SSDM.2008.D-2-4