Comparison of the Use of Different Encapsulate Adhesion Glue to Enhance the Efficiency and Lifetime of Polymer Solar Cells

C. M. Chen; M. H. Chang; T. E. Hsieh; R. M. Tang; Y. S. Tsai; W. P. Chu; M. O. Liu; F. S. Juang

doi:https://doi.org/10.7567/SSDM.2008.P-10-12

2008 International Conference on Solid State Devices and Materials

Sep 23, 2008 - Sep 26, 2008
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[P-10-12] Comparison of the Use of Different Encapsulate Adhesion Glue to Enhance the Efficiency and Lifetime of Polymer Solar Cells

C. M. Chen¹, M. H. Chang¹, T. E. Hsieh¹, R. M. Tang², Y. S. Tsai², W. P. Chu², M. O. Liu³, F. S. Juang² (1.National Chiao Tung Univ., 2.National Formosa Univ., 3.Industrial Tech. Res. Inst., Taiwan)

https://doi.org/10.7567/SSDM.2008.P-10-12

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