[P-2-7] Cu Electroplating Process with Magnetic Field for Flexible Device

N. Ooi¹、H. Aoki¹、D. Watanabe¹、J. Jong-Hyeon¹、C. Kimura¹、T. Sugino¹ (1.Osaka Univ., Japan)

https://doi.org/10.7567/SSDM.2008.P-2-7