[P-2-7] Cu Electroplating Process with Magnetic Field for Flexible Device

N. Ooi¹, H. Aoki¹, D. Watanabe¹, J. Jong-Hyeon¹, C. Kimura¹, T. Sugino¹ (1.Osaka Univ., Japan)

https://doi.org/10.7567/SSDM.2008.P-2-7