[P-4-6] Thermal Deformation and Failure Analysis of Phase Change Random Access Memory

H. X. Yang^1,2、L. P. Shi¹、H. K. Lee¹、R. Zhao¹、J. M. Li¹、K. G. Lim¹、T. C. Chong^1,2 (1.A*STAR、2.National Univ. of Singapore, Singapore)

https://doi.org/10.7567/SSDM.2008.P-4-6