[P-4-6] Thermal Deformation and Failure Analysis of Phase Change Random Access Memory

H. X. Yang^1,2, L. P. Shi¹, H. K. Lee¹, R. Zhao¹, J. M. Li¹, K. G. Lim¹, T. C. Chong^1,2 (1.A*STAR, 2.National Univ. of Singapore, Singapore)

https://doi.org/10.7567/SSDM.2008.P-4-6