[P-5-11L] A 33% Improvement in Efficiency of Wireless Inter-Chip Power Delivery by Thin Film Magnetic Material

K. Niitsu¹, Y. Yuxiang¹, H. Ishikuro¹, T. Kuroda¹ (1.Keio Univ., Japan)

https://doi.org/10.7567/SSDM.2008.P-5-11L