Characteristics and Integration Challenges of FinFET-based Devices for (Sub-)22nm Technology Nodes Circuit Applications

A. Veloso; M. J. H. Van Dal; N. Collaert; A. De Keersgieter; L. Witters; R. Rooyackers; A. Redolfi; S. Brus; R. Duffy; B. J. Pawlak; G. Vellianitis; B. Duriez; T. Mérelle; P. P. Absil; S. Biesemans; M. Jurczak; T. Hoffmann; R. J. P. Lander

doi:https://doi.org/10.7567/SSDM.2009.C-7-1

[C-7-1] Characteristics and Integration Challenges of FinFET-based Devices for (Sub-)22nm Technology Nodes Circuit Applications

A. Veloso¹, M. J. H. Van Dal², N. Collaert¹, A. De Keersgieter¹, L. Witters¹, R. Rooyackers¹, A. Redolfi¹, S. Brus¹, R. Duffy², B. J. Pawlak², G. Vellianitis², B. Duriez², T. Mérelle², P. P. Absil¹, S. Biesemans¹, M. Jurczak¹, T. Hoffmann¹, R. J. P. Lander² (1.IMEC(Belgium), 2.NXP-TSMC Res. Center(Belgium))

https://doi.org/10.7567/SSDM.2009.C-7-1

2009 International Conference on Solid State Devices and Materials

[C-7-1] Characteristics and Integration Challenges of FinFET-based Devices for (Sub-)22nm Technology Nodes Circuit Applications