[D-9-4] Prediction of Abnormal Etching Profile at High-Aspect-Ratio Via/ Hole Etching by using On-wafer Monitoring System
H. Ohtake1, S. Fukuda1, B. Jinnai1, T. Tatsumi2, T. Samukawa1
(1.Tohoku Univ.(Japan), 2.OKI Semiconductor Miyagi Co. Ltd.(Japan))
https://doi.org/10.7567/SSDM.2009.D-9-4
