[D-9-4] Prediction of Abnormal Etching Profile at High-Aspect-Ratio Via/ Hole Etching by using On-wafer Monitoring System

H. Ohtake¹、S. Fukuda¹、B. Jinnai¹、T. Tatsumi²、T. Samukawa¹ (1.Tohoku Univ.(Japan)、2.OKI Semiconductor Miyagi Co. Ltd.(Japan))

https://doi.org/10.7567/SSDM.2009.D-9-4