[P-2-13] Low-Capacitance and Low-Loss Bond Pad Design using LC-Resonator Structure in CMOS Technology for RF and High-Speed Applications

C. Y. Lin¹、M. D. Ker^1,2 (1.National Chiao Tung Univ.(Taiwan)、2.I-Shou Univ.(Taiwan))

https://doi.org/10.7567/SSDM.2009.P-2-13