[P-2-13] Low-Capacitance and Low-Loss Bond Pad Design using LC-Resonator Structure in CMOS Technology for RF and High-Speed Applications
C. Y. Lin1, M. D. Ker1,2
(1.National Chiao Tung Univ.(Taiwan), 2.I-Shou Univ.(Taiwan))
https://doi.org/10.7567/SSDM.2009.P-2-13