[P-2-2] Improvement of Cu seedless Ru barrier by insertion of an amorphous WCoCN interlayer

J. B. Yeh¹, D. C. Perng¹, K. C. Hsu¹ (1.National Cheng Kung Univ.)

https://doi.org/10.7567/SSDM.2009.P-2-2