[G-3-2] Analysis of Within-Die and Die-to-Die CMOS-Process Variation With Reconfigurable Ring-Oscillator Arrays

T. Ansari¹、W. Imafuku¹、A. Kawabata¹、M. Yasuda¹、T. Koide¹、H. J. Mattausch¹ (1.Hiroshima Univ. , Japan)

https://doi.org/10.7567/SSDM.2010.G-3-2