[G-6-5L] A SPICE-based Multi-physics Seamless Simulation Platform for CMOS-MEMS

T. Konishi¹、S. Maruyama²、T. Matsushima¹、M. Mita³、K. Machida^1,4、N. Ishihara⁴、K. Masu⁴、H. Fujita²、H. Toshiyoshi² (1.NTT Advanced Technology Corp.、2.Univ. of Tokyo、3.JAXA、4.Tokyo Tech , Japan)

https://doi.org/10.7567/SSDM.2010.G-6-5L