[G-6-5L] A SPICE-based Multi-physics Seamless Simulation Platform for CMOS-MEMS

T. Konishi¹, S. Maruyama², T. Matsushima¹, M. Mita³, K. Machida^1,4, N. Ishihara⁴, K. Masu⁴, H. Fujita², H. Toshiyoshi² (1.NTT Advanced Technology Corp., 2.Univ. of Tokyo, 3.JAXA, 4.Tokyo Tech , Japan)

https://doi.org/10.7567/SSDM.2010.G-6-5L