[H-5-3] Improvement of Variability and Reliability in Low-k/Cu Interconnects by Selectivity Control in Dry-Etching Process

I. Kume¹, M. Ueki¹, N. Inoue¹, J. Kawahara¹, N. Ikarashi¹, N. Furutake¹, S. Saitoh¹, Y. Hayashi¹ (1.Renesas Electronics Corp. , Japan)

https://doi.org/10.7567/SSDM.2010.H-5-3