[H-5-3] Improvement of Variability and Reliability in Low-k/Cu Interconnects by Selectivity Control in Dry-Etching Process

I. Kume¹、M. Ueki¹、N. Inoue¹、J. Kawahara¹、N. Ikarashi¹、N. Furutake¹、S. Saitoh¹、Y. Hayashi¹ (1.Renesas Electronics Corp. , Japan)

https://doi.org/10.7567/SSDM.2010.H-5-3