[H-8-2] Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration

E. Iwata¹, Y. Ohara¹, K. W. Lee¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2010.H-8-2