[H-8-2] Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration

E. Iwata¹、Y. Ohara¹、K. W. Lee¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2010.H-8-2