[H-8-3] Metal Micro-Bump Induced Stress in 3D-LSIs _a micro-Raman Study

M. Murugesan¹、Y. Ohara¹、J. C. Bea¹、K. W. Lee¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2010.H-8-3