[H-8-3] Metal Micro-Bump Induced Stress in 3D-LSIs _a micro-Raman Study

M. Murugesan¹, Y. Ohara¹, J. C. Bea¹, K. W. Lee¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2010.H-8-3