Near-Infrared Image Sensor Fabricated Using Compliant Bump

N. Watanabe; F. Hoashi; Y. Nagai; H. Inada; Y. Iguchi; T. Asano

doi:https://doi.org/10.7567/SSDM.2010.H-9-2

2010 International Conference on Solid State Devices and Materials

Sep 21, 2010 - Sep 24, 2010
The University of Tokyo, Tokyo, Japan

[H-9-2] Near-Infrared Image Sensor Fabricated Using Compliant Bump

N. Watanabe^1,3, F. Hoashi¹, Y. Nagai², H. Inada², Y. Iguchi², T. Asano¹ (1.Kyushu Univ., 2.Sumitomo Electric Industries, Ltd., 3.Fukuoka Industry Sci, and Tech. Foundation , Japan)

https://doi.org/10.7567/SSDM.2010.H-9-2

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