Near-Infrared Image Sensor Fabricated Using Compliant Bump

N. Watanabe; F. Hoashi; Y. Nagai; H. Inada; Y. Iguchi; T. Asano

doi:https://doi.org/10.7567/SSDM.2010.H-9-2

2010 International Conference on Solid State Devices and Materials

2010年9月21日〜 2010年9月24日
The University of Tokyo, Tokyo, Japan

[H-9-2] Near-Infrared Image Sensor Fabricated Using Compliant Bump

N. Watanabe^1,3、F. Hoashi¹、Y. Nagai²、H. Inada²、Y. Iguchi²、T. Asano¹ (1.Kyushu Univ.、2.Sumitomo Electric Industries, Ltd.、3.Fukuoka Industry Sci, and Tech. Foundation , Japan)

https://doi.org/10.7567/SSDM.2010.H-9-2

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