[P-2-1] Development of Versatile Backside Via Technology for 3D System on Chip

Y. Ohara¹、K. Lee¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2010.P-2-1