[P-2-3] Stress Mapping of Silicon Surrounded by Various Through Silicon Via (TSV) Patterns using Polychromator-Based Multi-Wavelength Raman Spectroscopy

A. D. Trigg¹、L. H. Yu¹、C. C. Kuo¹、R. Kumar¹、D. L. Kwong¹、T. Ueda²、T. Ishigaki²、K. Kang²、W. S. Yoo² (1.Insitute of Microelectronics , Singapore、2.WaferMasters, Inc. , USA)

https://doi.org/10.7567/SSDM.2010.P-2-3