[P-2-3] Stress Mapping of Silicon Surrounded by Various Through Silicon Via (TSV) Patterns using Polychromator-Based Multi-Wavelength Raman Spectroscopy

A. D. Trigg¹, L. H. Yu¹, C. C. Kuo¹, R. Kumar¹, D. L. Kwong¹, T. Ueda², T. Ishigaki², K. Kang², W. S. Yoo² (1.Insitute of Microelectronics , Singapore, 2.WaferMasters, Inc. , USA)

https://doi.org/10.7567/SSDM.2010.P-2-3