[A-4-3] Fluidic Self-Assembly for Heterogeneous Integration of High Performance Resonant Tunneling Diodes Using Low-Melting Point Alloy Bumps

J. Nakano¹、T. Shibata¹、T. Okatsu¹、M. Mori¹、K. Maezawa¹ (1.Univ. of Toyama , Japan)

https://doi.org/10.7567/SSDM.2011.A-4-3