[C-1-1] TSV and Cu-Cu direct bonding: two key technologies for High Density 3D

N. Sillon¹、H. Ben Jamaa¹、P. Leduc¹、L. Di Cioccio¹、S. Cheramy¹、T. Signamarcheix¹ (1.CEA-LETI/MINATEC , France)

https://doi.org/10.7567/SSDM.2011.C-1-1