[K-3-2] Sub-micron-accuracy Gold to Gold Interconnection Flip-Chip Bonding Approach for Electronics-Optics Heterogeneous Integration

T. T. Bui¹、L. Ma¹、M. Suzuki¹、F. Kato¹、S. Nemoto¹、N. Watanabe¹、M. Aoyagi¹ (1.National Inst. of Advanced Industrial Science and Tech. , Japan)

https://doi.org/10.7567/SSDM.2012.K-3-2