[K-3-3] Optoelectronic Heterogeneous Integration Tech. Using Reductant-assisited Self-Assembly with Cu/Sn Microbump

Y. Ito^1,2、T. Fukushima²、K. W. Lee²、K. Choki¹、T. Tanaka²、M. Koyanagi² (1.Sumitomo Bakelite Co., Ltd.、2.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2012.K-3-3