3D Integration with Wafer-to-Wafer Bonding

W. C. Lo; C. T. Ko; K. N. Chen

doi:https://doi.org/10.7567/SSDM.2012.K-4-1

2012 International Conference on Solid State Devices and Materials

2012年9月25日〜 2012年9月27日
Kyoto International Conference Center, Kyoto, Japan

[K-4-1] 3D Integration with Wafer-to-Wafer Bonding

W. C. Lo¹、C. T. Ko^1,2、K. N. Chen² (1.Electronics and Optoelectronics Research Laboratories, Industrial Tech. Research Inst. (ITRI),、2.National Chiao Tung Univ., , Taiwan)

https://doi.org/10.7567/SSDM.2012.K-4-1

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